Titanium anode for galvanized/tin steel belt

Galvanized sheet has good corrosion resistance, workability, weldability, and lacquerability. It is mainly used in automobiles, household appliances, the light industry, and other industries. Electro galvanizing products according to different coatings, double-sided, single-sided, and different thickness coating varieties. At the same time, according to the different plating post-processing, passivation, phosphating, fingerprint resistance, and other products.

The electroplating tin plate is mainly used in the packaging industry, it has excellent corrosion resistance, beautiful appearance, high strength, lightweight, good formability, and good resistance to organic material, dilute acid, alkali, and salt erosion performance. Tin plating products can be further subdivided into two categories: food (that is, food packaging products) and general purpose products (that is, non-food packaging products). For these processes, Tykin provides titanium anodes.

Brief description of the production process

After several pretreatment processes, the cathodized strip passes through a series of electrolyzers. In these cells, the electrolyte contains soluble zinc or tin ions, which are deposited electrolytically on the surface of the strip after an electrochemical reaction. In these processes, Tykin provides titanium anodes for electrochemical galvanization of steel sheets or tin.

Titanium anode for electroplating PCB board

Electroplating is the coating of a thin layer of metal, such as copper, nickel, tin, gold, silver, platinum, rhodium, palladium, or their alloys, on the surface of an electronic component. The Electronic plating processes can be used in a wide variety of applications, including bulk plating of circuit boards and connectors, and a variety of continuous plating processes for the production of semiconductors, connectors, and other components used in the electronics industry. Both soluble and inert titanium anodes are used in these processes.

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Reverse pulse copper plating of the circuit board

Due to PCB design requirements tend to thin wire diameter, high density, small aperture (high depth to diameter ratio, even micro hole), and fill in the blind holes, the traditional dc plating is becoming more and more can't meet the requirements, especially in the center of the aperture of plating coating, usually appear on both ends of the aperture of the copper layer thickness but the phenomenon of the insufficient center copper layer. The uneven coating will affect the effect of current transport and directly lead to poor product quality. To balance the thickness of the copper on the surface, especially in the holes and micropores, the current density is forced to be reduced, but this can extend the plating time UNACCEPtably. With the development OF the reverse pulse electroplating process and chemical additives suitable for the electroplating process, it has become a reality to shorten plating time. These problems can be overcome by the reverse pulse electroplating process.

Typical process conditions

Electrolytes: CuSO4 5H2O, 100-300 g/l

H2SO4, 50-150 g/l

Additive

Temperature: 20-70 °C

Current density: usually 500-1000A/M2 forward pulse current and three times the reverse pulse current; Generally, the forward pulse is 19ms and the reverse pulse is 1ms; Or adjust the current density and pulse time according to the process.