Copper sintered filter is a type of filter used in high-temperature, high-pressure, and corrosive environments, with its main component being high-purity copper material. These filters are crafted through a unique sintering process, exhibiting robust durability and excellent conductivity. They find extensive applications in industries such as chemical, petroleum, electronics, and aerospace.

Products Specifications

Material	Copper
parameters	1501105.0
Filtration accuracy	20-30μm
Technique	Sintering

Advantages of copper

Conductivity: Copper is an excellent conductor of electricity with superior electrical conductivity. This makes copper metal sintered filters highly popular in applications that demand good electrical conductivity, such as in the field of electronics.

Thermal Conductivity: Copper exhibits excellent thermal conductivity, facilitating the rapid transfer of heat. In high-temperature environments, copper metal sintered filters can effectively dissipate heat, maintaining stable temperatures.

Corrosion Resistance: Copper demonstrates good corrosion resistance to various chemical substances, showcasing excellent performance when handling corrosive media in copper metal sintered filters.

High-Temperature Stability: Copper maintains relative stability at high temperatures, resisting deformation or oxidation. Therefore, it is suitable for applications in high-temperature conditions, such as in aerospace and chemical industries.

Processability: Copper is easy to process and shape, allowing manufacturers to produce copper metal sintered filters in different shapes and sizes to meet diverse application requirements.

Environmental Friendliness: Copper is a recyclable material, demonstrating good environmental sustainability. Recycling contributes to reducing resource consumption and environmental impact.

the application of copper in the electronics industry

The electronics industry is a burgeoning sector that continually explores new products and applications for copper in its flourishing development. Its applications have evolved from vacuum devices and printed circuits to microelectronics and semiconductor integrated circuits.

Vacuum Devices

Vacuum devices primarily include high-frequency and ultra-high-frequency emitting tubes, waveguide tubes, magnetrons, etc. These devices require high-purity oxygen-free copper and dispersion-strengthened oxygen-free copper.

Printed Circuits

Copper-clad printed circuits use copper foil as the surface, adhered to a supporting plastic board. Unwanted parts are removed through etching, leaving behind interconnected circuits. The circuit is then assembled by punching holes at the connections on the printed circuit board, inserting the terminals of discrete components, and soldering them onto this circuit. Using the immersion plating method allows the soldering of all joints to be completed at once. Printed circuits are widely applied, particularly in cases where finely arranged circuits are needed, such as in radios, televisions, computers, etc., saving a significant amount of labor in wiring and circuit fixation and requiring a substantial amount of copper foil.

Integrated Circuits

The core of microelectronics is integrated circuits. Integrated circuits refer to miniature circuits where components and interconnecting lines are integrated within, on, or above a semiconductor crystal substrate (chip) using specialized process technology. This type of microcircuit is thousands of times smaller in size and weight compared to the most compact discrete component circuits. Recently, the internationally renowned computer company IBM (International Business Machines Corporation) achieved a breakthrough by replacing aluminum with copper in the interconnecting lines of silicon chips. This new type of copper-based microchip can achieve a 30% efficiency gain, reduce the circuit line size to 0.12 micrometers, and enable the integration of up to 2 million transistors on a single chip. This marks a new era for the ancient metal copper in the application of the latest technology in semiconductor integrated circuits.

Lead Frames

To protect the normal operation of integrated circuits or hybrid circuits, they need to be encapsulated, and a large number of connectors from the circuit need to be led out during encapsulation. These leads require a certain strength and form the supporting framework of the integrated encapsulated circuit, known as the lead frame. In actual production, to achieve high-speed mass production, lead frames are usually continuously stamped in a specific arrangement on a metal strip. The material cost of the frame accounts for 1/3 to 1/4 of the total cost of the integrated circuit, and it is used in large quantities. Therefore, it must have a low cost.