1um porous titanium filter cartridge for semiconductor wet processing delivers absolute-rated particle retention in aggressive chemical environments where polymer membranes swell or degrade. Fabricated from ≥99.4% industrial high-purity titanium powder via cold isostatic pressing and high-temperature vacuum sintering, this metal powder sintered filter achieves uniform microporous structure with porosity ranging 30-40% and narrow pore size distribution. In API pharmaceutical production decarbonization filtration, the 1μm sintered titanium rod filter captures fine activated carbon residues and catalyst fines from high-viscosity mother liquors, with reusable backwash capability extending service life several times beyond membrane alternatives. Wet-process semiconductor fabrication integrates 1um titanium powder sintered filters in chemical delivery lines for SC-1, SC-2, 49% HF, and HNO₃ streams, where the titanium substrate resists pitting from chloride-rich environments that corrode stainless steel grades. The 1um precision rating removes submicron silicon-containing particulates and metallic contaminants without shedding particles, maintaining filtrate purity required for nanometer-scale wafer processing.

1um Porous Titanium Filter Cartridge for Semiconductor Wet Processing 2

High-purity water treatment loop applications deploy 1um porous titanium filter cartridge for semiconductor wet processing as final security filtration ahead of ultrafiltration and EDI systems, where the titanium powder sintered element withstands periodic ozone sterilization and steam-in-place cycles up to 280°C in wet conditions. Unlike polypropylene depth filters or PTFE membrane cartridges that soften or delaminate under thermal cycling, the vacuum-sintered titanium matrix retains dimensional integrity across pH 1-14 range and withstands differential pressures up to 5.0 bar without pore structure collapse. CMP slurry polishing loops in advanced fabs use 1μm titanium filter cartridges post-resin adsorption stages to trap agglomerated abrasive oversize particles while preserving engineered particle size distribution of colloidal silica or ceria slurries. The non-particle-shedding characteristic and online regenerability via backflushing or ultrasonic cleaning enable repeated reuse, reducing filter replacement frequency and operating costs in continuous semiconductor wet bench operations.

Products Specifications

Material	GR1 Titanium powder
Filtration grade/Pore size	1um
Diameter	80mm
Length	500mm
Connection	M30
Technique	Sintering

Products Features

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Precision filtration rating – The 1um porous titanium filter cartridge delivers absolute-rated particle retention in semiconductor wet processing lines, removing submicron silicon residues, metallic contaminants, and gel-like particles from aggressive chemistries including HF, HNO₃, SC-1, and SC-2 without media breakthrough.

Corrosion resistance in extreme pH ranges – Manufactured from ≥99.4% high-purity titanium powder via vacuum sintering, this sintered titanium filter cartridge withstands pH 1–14 environments, resisting pitting and chloride attack that rapidly degrades stainless steel or Hastelloy filters in wet bench chemical distribution systems.

High thermal stability for hot DIW and SIP cycles – The titanium powder sintered filter endures continuous operation at 280°C in wet conditions, supporting steam-in-place (SIP) sterilization and hot deionized water rinses without softening, delaminating, or leaching extractables common to polypropylene or PTFE membrane cartridges.

No particle shedding – Unlike depth filters or wound cartridges, the rigid sintered metal structure eliminates fiber release or media migration, maintaining ultrapure filtrate essential for nanometer-scale wafer fabrication where any foreign particle >0.5μm causes fatal device defects.

Excellent backwashing regenerability – The 1um porous titanium filter cartridge supports online backflushing, ultrasonic cleaning, and acid regeneration, removing captured solids and restoring initial flow rates over dozens of reuse cycles, significantly reducing cartridge replacement frequency and operating costs in high-volume fabs.

High differential pressure tolerance – Vacuum-sintered titanium matrix maintains pore structure integrity under differential pressures up to 5.0 bar, outperforming membrane filters that collapse or rupture during surge flows or clogging events in semiconductor wet processing equipment.

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Products Applications

High-purity chemical distribution lines in wafer fabs – Installed in point-of-use (POU) filter housings for 49% HF, HNO₃, NH₄OH, H₂SO₄, and HCl streams, the 1um sintered titanium filter cartridge removes submicron metallic particulates and silicon dust before wet benches and single-wafer processors.

Ozonated deionized water (DIO₃) recirculation loops – Applied as security filtration in post-CMP cleaning and photoresist stripping tools. The 1um porous titanium cartridge resists ozone concentrations up to 20 ppm and continuous UV exposure, where polypropylene filters embrittle and PTFE membranes lose mechanical integrity.

CMP slurry polishing loops – final polish and bulk removal – Positioned after slurry blending tanks and before dispense arms for colloidal silica, ceria, or alumina slurries. The sintered titanium filter traps over-sized agglomerates (>1um) while preserving native particle size distribution and zeta potential, maintaining a consistent removal rate and within-wafer non-uniformity (WIWNU).

Post-CMP brush box scrubber water filtration – Installed in deionized water lines feeding PVA brushes to recapture residual abrasive particles and copper ions after wafer polishing. The 1um absolute rating prevents microscratches on copper and low-k dielectric surfaces during brush contact.

Ultrapure water (UPW) polishing loop final security filter – Positioned ahead of point-of-use (POU) valves in wet etch and rinse stations. The titanium powder filter cartridge operates in hot UPW (80°C) and periodic steam sterilization cycles without shedding particles, maintaining bacterial control and particle counts below class 1 requirements.

Electroless nickel and cobalt plating baths for barrier/seed layers – Integrated into plating bath purification skids to remove particulate contamination from stabilizers and complexing agents. The corrosion-resistant titanium matrix operates at elevated temperatures (70-90°C) and alkaline pH without hydrogen embrittlement or bath contamination.