Titanium Alloy Sputtering Targets With High Purity

Titanium sputtering targets with high purity are sputtering sources that form various functional thin films on substrates by magnetron sputtering, multi-arc ion plating or other types of coating systems under appropriate process conditions. Simply put, the target material is the target material bombarded by high-speed charged particles. 

It is used in high-energy laser weapons. When lasers with different power densities, different output waveforms, and different wavelengths interact with different targets, they will produce different kills and damages. effect. For example: evaporation magnetron sputtering coating is heating evaporation coating, aluminum film and so on. By replacing different target materials (such as aluminum, copper, stainless steel, titanium, nickel targets, etc.), different film systems (such as superhard, wear-resistant, anti-corrosion alloy films, etc.) can be obtained.

Parameters

Features

1. Light weight

2. High specific strength

3. Corrosion resistance

4. High and low temperature resistance

Applications

★Shipbuilding ★Electrolytic Plating ★Aerospace ★Chemical Industry ★Medical Equipment

Details

Made of high-quality raw materials, wear-resistant and corrosion-resistant, long-term use

No peeling cracks on the surface, no oil stains, smooth and clean side surface

Complete specifications, arbitrary cutting, support non-standard customization

The purity of the target material has a great effect on the performance of the film. Purity is one of the target performance indicators.

Purity

Purity of the target is one of the main performance indicators of the target because the purity of the target greatly affects the performance of the film. However, in actual applications, the requirements for purity of the target material are not the same. For example, with the rapid development of the microelectronics industry The size of the silicon wafer was expanded from 6 ", 8" to 12 ", the wiring width was reduced from 0.5 um to 0.25 um, 0.18 um, and 0.13 um. Previously, the target purity was 99.995%.

Impurity content

The main source of the deposited film is the oxygen and moisture of the target solids and pores. Targets for various applications have different requirements for different impurity levels. For example, targets of pure aluminum and aluminum alloys used in the semiconductor industry have special requirements for alkali metal content and radioactive element content.

Density

In order to reduce the pores of the target solids and improve the performance of sputtered films, the targets typically need to be more densely. The target density affects not only the sputtering rate but also the electrical and optical properties of the film. The higher the target density, the better the film performance. In addition, when the target density and intensity are raised, the target can withstand the thermal stress during sputtering. Density is one of the target performance indicators.

Grain size and size distribution

Usually the target is polycrystalline, and the particle size may be in the order of micrometers to millimeter. In the case of the same target, the sputtering rate of the fine-grained target is faster than the sputtering rate of the coarse grained target, while sputter deposition of the smaller particle size (uniform distribution) target has a uniform thickness distribution (uniform). Distribution.

If you are interested in the titanium sputtering targets with high purity, please feel free to contact us:

E-mail: zhangjixia@bjygti.com

Homepage: http://www.toptitech.com

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